新聞資訊
重熔工藝對(duì)應(yīng)變誘導(dǎo)熔化激活法制備ZCuSn10銅合金半固態(tài)組織的影響
發(fā)布人：上海艾荔艾金屬材料有限公司m.85978597.cn
更新時(shí)間：2015-08-26
采用包括鍛造與重熔的應(yīng)變誘導(dǎo)熔化激活(SIMA)法制備ZCuSn10銅合金半固態(tài)坯料，分析重熔過程中重熔溫度和保溫時(shí)間對(duì)ZCuSn10半固態(tài)坯料微觀組織的影響。
重熔工藝對(duì)應(yīng)變誘導(dǎo)熔化激活法制備ZCuSn10銅合金半固態(tài)組織的影響Effect of remelting process on microstructure of semi-solid
ZCuSn10 copper alloy fabricated by strain induced melt activated method
采用包括鍛造與重熔的應(yīng)變誘導(dǎo)熔化激活(SIMA)法制備ZCuSn10銅合金半固態(tài)坯料，分析重熔過程中重熔溫度和保溫時(shí)間對(duì)ZCuSn10半固態(tài)坯料微觀組織的影響。結(jié)果表明：在900
℃保溫時(shí)，隨著保溫時(shí)間的延長(zhǎng)，合金的平均晶粒直徑增大，保溫時(shí)間由5 min延長(zhǎng)至50 min時(shí)，平均晶粒直徑由45.9 μm增大至74.7
μm；晶粒形狀因子隨保溫時(shí)間的延長(zhǎng)先減小后增大。保溫30 min時(shí)，隨著保溫溫度的升高，平均晶粒直徑減小，當(dāng)保溫溫度由850 ℃升高至925
℃時(shí)，平均晶粒直徑由72.6 μm減小至64.1 μm；晶粒形狀因子隨保溫溫度的升高而增大。900 ℃保溫30
min獲得的半固態(tài)組織均勻、球化效果好，平均晶粒尺寸為64.7 μm，形狀因子為1.65。
Semi-solid ZCuSn10 copper alloy was fabricated by strain
induced melt activated (SIMA) method including the forging and remelting
process. The effect of remelting temperature and holding time on the
microstructure of semi-solid ZCuSn10 copper alloy was investigated. The results
indicate that, with the increase of the holding time at 900 ℃, the mean grain
diameter of the alloy increases. With the increase of the holding time from 5
min to 50 min, the mean grain diameter increases from 45.9 μm to 74.7 μm, and
the shape factor decreases first and then increases. With the increase of the
remelting temperature at the holding time of 30 min, the mean grain diameter
decreases. With increasing the remelting temperature from 850 ℃ to 925 ℃, the
mean grain diameter decreases from 72.6 μm to 64.1 μm, and the shape factor
increases. The semi-solid ZCuSn10 copper alloy with uniform and spherical grains
can be obtained at remelting temperature of 900 ℃ and the holding time of 30
min, the mean grain diameter of the alloy is 64.7 μm and the shape factor is
1.65.
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